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Workshops

PACKAGING CONFERENCE 2014

Theme : Breaking New Frontiers in Electronic Manufacturing

Organised by  

Workshop

Title

Date

Speaker

Industry : PCBA / EMS

A

10 Deadly Sins of SMT

10 June

Joe Belmonte, Principal Consultant, ITM Consulting, USA

B

Key factors in the Design for Manufacturability (DFM) process

11 June

C

Best Practices in Electronics Assembly Processes

12 June

D

Electronics Reliability and Failure Analysis

10 June

Bhanu Sood, Director of Test Services and Failure Analysis Laboratory, University of Maryland's, 
Center for Advanced Life Cycle Engineering (CALCE), USA

E

Manufacturing and Reliability Guidelines for Electronic Enclosures

11 June

F

Preventing Failures in Printed Circuit Boards

12 June

Industry: PCBA / EMS, IC Packaging

G

 

An Update on PoP and BTC Assembly: Material, Process and Reliability

10 June

Dr Jennie S. Hwang, Principle Consultant, H-Technologies Group, USA

H

 

SMT Manufacturing: Preventing Production Defects and Product Failures
Part 1: Board-level Assembly, Solder Joint & Soldering
Part 2: Components and PCB Board

11 & 12 June

Industry: IC Packaging, Wafer Fabrication

I

Integrated Circuit Packaing and Assembly Processes

10 June

Dr Thomas Dory, Research & Development Manager, Fujifilm Electronics Materials, USA

J

High Speed RF Design

11 June

K

Flip Chip Package Technology and Assembly

12 June

Industry: All

L

Practical Design Failure Modes and Effects Analysis (DFMEA)

10 June

Bong Kok Liang, Principle Consultant, Blue Ocean Consulting, Malaysia

M

Practical Design of Experiments (DOE) for Process and Qualtiy Optimization

11 & 12 June

 

For more information, please contact:

Phone: 603-2170 1588
Fax: 603-2166 5451

Email: nepcon@knowledgegroupco.com